Copper iodide (CuI) is one of the promising materials for use in many applications such as organic electronic devices. In this work, CuI nanoparticles were prepared using the exploding wire technique in an iodine solution and were deposited as thin films by a spin coating method to study its electrical properties. This study showed that all prepared thin films were a poly-crystalline structure with γ phase. The electrical study showed that al film was p-type. The dielectric parameters depended on frequency and voltage. It can be noticed a small increase in ac conductivity by increasing the applied voltages in the lower range, but there is a noticeable increase in conductivity at 1 volt.
Abdullah, Sawsan Hussein; Salman, Mohammed Oudah Dr; and Humud, Hammad Raheem Dr
"Electrical Properties of Copper Iodine Prepared by Exploding Wire,"
Karbala International Journal of Modern Science: Vol. 5
, Article 3.
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